What is the difference between electroplating and physical vapor deposition(PVD)?
Electroplating and physical vapor deposition(PVD) are both widely adopted methods for thin film coating technologies and surface finishing,they enhance the appearance,durability and functionality of metal surfaces
Electroplating involves immersing a substrate and a metal anode in an electrolyte solution. It uses an electric current to deposit a thin layer of metal onto the substrate.
Electroplating is often used to enhance the appearance and functionality of semiconductors,printed circuits,connectors and other electronics as well as jewelry and fashion accessories.
Physical vapor deposition(PVD) is a vacuum-based process in which materials are vaporized and then deposited onto a substrate to form a think film, it involves various techniques,such as sputtering and evaporation, to achieve the desired coating. PVD coatings are widely used on consumer goods like computers,smartwatches,cameras,VR devices,LEDS,etc.
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