conductive plastic masterbatch for all kinds of conductive/EMI shielding
Product Name: Conductive Plastic Agglomerates
Description:PC-ABS SUPER TOUGH AND ELEVATED TEMPERATURE GRADES (ST)
Provides up to high temperature 105° C continuous use temperature rating and the lowest possible surface resistivity for excellent grounding properties. Filled with nickel-plated carbon fiber exclusively to maximize conductive properties of the molded product.
Purpose: Antistatic turnover box, IC and LCD pallet, IC encapsulation, wafer carrier, film bag for production process of precise electronic component such as integrated circuit, wafer and transducer; housing and structural parts of anti-explosion products; semi-conductive shielding compound used in middle and high voltage cable; EMI shielding housing of electric appliance in fields of telecommunication, computer, automatic system, electronic products for industry, consumption and automobile.
Range Of Application: Plastic products such as PVC, PP, PA, PC, TPU, PE and ABS are available. It is easy to color and recyclable.
ENGINEERING AND PRODUCT SUPPORT
Our experienced engineers are available to help with optimal material selection and manufacturing strategies for each project. This includes support to ensure properly matched EMI gaskets, product design strategies, tooling, and other needs.
|Fiber Filaments (f)||5000~10000|
|Agglomerate length(mm)||1～10 (its length should be consistent for same specification)|
|Agglomerate Diameter (mm)||2|
|Agglomerate External Appearance||the surface is smooth|
No Packaging Size Limitations
Dry blends (that use multiple pellet mixtures) have packaging limitations – they are sold only in smaller bags or containers, and carry the risk of the heavier pellets settling during transportation.
When settling occurs, it results in inconsistency in shielding and mechanical performance. Large volume programs can save significant labor hours by using single pellet products such as PREMIER.